scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883. "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Bin Speed 01 1460A 6000 gate, field programmable gate array 126.6 ns 02 1460A-1 6000 gate, field programmable gate array 107.6 ns

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X CMGA9 - PN 207 Pin grid array Y See figure 1 196 Flat pack

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

DC supply voltage range (V_DD) ------------------ −0.5 V dc to +7.0 V dc Input voltage range (V_I) ----------------------- −0.5 V dc to V_DD + 0.5 V dc Output voltage range (V_O) ---------------------- −0.5 V dc to V_DD + 0.5 V dc I/O Source/Sink current (I_IO) ------------------ ±20 mA Storage temperature range (T_STG) --------------- −65°C to +150°C Lead temperature (soldering, 10 seconds) ------- 300°C Thermal resistance, junction-to-case (θ_JC): Case X ----------------------------------------- See MIL-STD-1835 Case Y ----------------------------------------- 11°C/W 2/ Maximum junction temperature (T_J) -------------- +175°C

Supply voltage (V_DD) ---------------------------- +4.5 V dc to +5.5 V dc Case operating temperature range (T_C) ----------- −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) ------------- XX percent 3/

intended Use: