scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q. and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V devices shall meet or exceed the electrical performance characteristics specified in table I herein after exposure to the specified irradiation levels specified in the absolute maximum ratings herein and the RHA marked device shall be marked in accordance with MIL-I-38535. A dash (-) indicates a non RHA device.

The device types shall identify the circuit function as follows:

Device type Generic number Circuit function 01 87C51FC High performance CHMOS single chip 8-bit microcontroller with 32K bytes user programmable EPROM 02 87C51FC-16 High performance CHMOS single-chip 8-bit microcontroller with 32K bytes user programmable EPROM

This device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for NON-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter 1/ Descriptive designator Terminals Package style T See figure 1 44 Ceramic chip carrier, J-leaded package U CQCC1-N44 44 Square chip carrier package X CDIP2-T40 or 40 Dual-in-line package GDIP1-T40 40 Dual-in-line package Z See figure 1 44 ceramic chip carrier, gullwing-leaded package

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Storage temperature range ................................ −65°C to +150°C Voltage on EA/V_PP pin to V_SS.............................. 0.0 V dc to +13.0 V dc Voltage on any other pin to V_SS........................... −0.5 V dc to +6.5 V dc Maximum I_OL per I/O pin .................................. 15 mA Power dissipation (P_D) ................................... 1.5 W 1/ Lead temperature (soldering 10 seconds)................... 265°C Thermal resistance, junction-to-case (θ_JC): Cases U and X .......................................... See MIL-STD-1835 Cases T and Z .......................................... 14°C/W Endurance................................................. 50 cycles/byte, minimum Data retention............................................ 10 years, minimum

Case Operating Temperature Range ......................... −55°C to +125°C 2/ Supply Voltage, Vcc ...................................... +5.0 V dc ± 20% Oscillator frequency...................................... 3.5 MHz to 16 MHz

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - - - - -XX percent 3/

intended Use: