Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.

Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing.

Device class Q devices will replace device class M devices.

Microcircuit die conforming to this drawing are intended for use in microcircuits built in accordance with MIL-PRE-38535 or MIL-PRF-38534 for government microcircuit applications (original equipment), design applications and logistics purposes.

Comments on this appendix should be directed to DSCC-V/A, Columbus, Ohio, 43216-5000 or telephone (614) 692-0674.

The abbreviations, symbols, and definitions used herein are defined within MIL-PRF-38535 and MIL-STD-1331.

Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed within QML-38535 have submitted a certificate of compliance (see 30.6 herein) to DSCC-VA and have agreed to this drawing.

Die bonding pad locations and electrical functions Die physical dimensions. Die size: 495 mils × 495 mils. Die thickness: 17.5 ±1 mils. Interface materials. Top metallization: Si Al Cu 9 kA−12.5 kA Backside metallization: None: Backgrind Glassivation. Type: PSG Thickness: 9kA/ ±11 kA Substrate: EPI on single crystal silicon Substrate potential: Tied to V_DD Special assembly instructions: None

STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 98-06-29

Approved sources of supply for SMD 5962-92118 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535.

STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued.

Vendor CAGE Vendor name number and address 65342 UTMC Microelectronics System Inc. 4350 Centennial Boulevard Colorado Springs, Colorado 80907-3486

The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.