DLA - SMD-5962-92118 REV A
MICROCIRCUIT, DIGITAL, CMOS, MIL-STD-1553 SERIAL MICROCODED MONOLITHIC MULTI-MODE INTELLIGENT TERMINAL, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 6 August 1993 |
| Status: | inactive |
| Page Count: | 29 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 UT69151 MIL-STD-1553 Bus controller, remote terminal, monitor interface
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style X CMGA-P84 84 Pin grid array Y See figure 1 84 Leaded chip carrier
The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage range (VDD) - - - - - - - - - - - - - - - - - - −0.3 V dc to +7.0 V dc Voltage on any pin (VI/O) - - - - - - - - - - - - - - - - - - −0.3 V dc to VDD + 0.3 V dc Case operating temperature range (TC) - - - - - - - - - - - - −55°C to +125°C Storage temperature range (TSTG) - - - - - - - - - - - - - - - −65°C to +150°C Latchup immunity (ILU) - - - - - - - - - - - - - - - - - - - - ±150 mA DC input current (II) - - - - - - - - - - - - - - - - - - - - ±10 mA Maximum power dissipation (PD) - - - - - - - - - - - - - - - - 2.5 W Junction temperature (TJ) - - - - - - - - - - - - - - - - - - +175°C Lead temperature (TS) (soldering, 5 seconds) - - - - - - - - - +300°C Thermal resistance, junction-to-case (ΘJC) - - - - - - - - - - 15° C/W
Supply voltage range (VDD) - - - - - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc Case operating temperature (TC) - - - - - - - - - - - - - - - −55°C to +125°C DC input voltage (VIN) (any pin) - - - - - - - - - - - - - - - 0 V dc to VDD Maximum input voltage (VIL) - - - - - - - - - - - - - - - - - 0.8 V dc Maximum input voltage, 24 MHz input (VILC) - - - - - - - - - - 0.3VDD Minimum input voltage (VIN) - - - - - - - - - - - - - - - - - 2.2 V dc Minimum input voltage, 24 MHz input (VIHC) - - - - - - - - - - 0.7VDD Operating frequency (FIN) - - - - - - - - - - - - - - - - - - 24 ± .01% MHz Duty cycle (DC) - - - - - - - - - - - - - - - - - - - - - - - 50 ± 5%
Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - - - - 95.12 percent 2/
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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