Printed Board Assemblies - Part 4: Sectional Specification - Requirements for Terminal Soldered Assemblies
|Publication Date:||1 August 1998|
|ICS Code (Mechanical structures for electronic equipment):||31.240|
This standard prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are totally terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting).
This specification recognizes that electrical and electronic assemblies are subject to classifications by intended end-item use. Three general end-product levels have been established to reflect differences in producibility, complexity, functional performance requirements, and verification (inspection/test) frequency. These are the following:
Level A: General electronic products
Level B: Dedicated service electronic products
Level C: High-performance electronic products
The user of the assemblies is responsible for determining the level to which his product belongs. The contract shall specify the level required and indicate any exceptions or additional requirements to the parameters, where appropriate. It should be recognized that there may be overlaps of equipment between level where appropriate (see clause 4 in IEC 61191-1).