scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number 1/ Circuit function Access time 01 7C443 2K × 9 Clocked FIFO 30 ns 02 7C443 2K × 9 Clocked FIFO 20 ns 03 7C443 2K × 9 Clocked FIFO 14 ns 04 7C441 512 × 9 Clocked FIFO 30 ns 05 7C441 512 × 9 Clocked FIFO 20 ns 06 7C441 512 × 9 Clocked FIFO 14 ns

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and Qualification to MIL-PRF-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X GDIP4-T28 32 Dual-in-line Package Y CQCC1-N32 32 Rectangular leadless chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range to ground potential (V_CC) - - - - - - −0.5 V dc to +7.0 V dc DC voltage applied to the outputs in the high Z state - - −0.5 V dc to +7.0 V dc DC input voltage - - - - - - - - - - - - - - - - - - - - - −3.0 V dc to +7.0 V dc Maximum power dissipation - - - - - - - - - - - - - - - - 0.825 W Lead temperature (soldering, 10 seconds) - - - - - - - - - +260°C Thermal resistance, junction-to-case (Θ_JC): Case X - - - - - - - - - - - - - - - - - - - - - - - - 11°C/W Case Y - - - - - - - - - - - - - - - - - - - - - - - - See MIL-STD-1835 Junction temperature (T_J) - - - - - - - - - - - - - - - - +175°C Storage temperature range - - - - - - - - - - - - - - - - −65°C to +150°C Temperature under bias - - - - - - - - - - - - - - - - - - −55°C to +125°C

Supply voltage (V_CC) - - - - - - - - - - - - - - - - - - - +4.5 V dc minimum to +5.5 V dc maximum Ground voltage (GND) - - - - - - - - - - - - - - - - - - - 0 V dc Input high voltage (V_IH) - - - - - - - - - - - - - - - - - 2.2 V dc minimum Input Low voltage (V_IL) - - - - - - - - - - - - - - - - - 0.8 V dc maximum Case operating temperature range (T_C) - - - - - - - - - - −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . 3/ percent

intended Use: