scope:

FOREWORD

A digital automated test program generator (DATPG) produces test pattern and diagnostic data that can be used for testing printed circuit assemblies on automatic test equipment (ATE). The use of several DATPGs, all with individual output formats, created a need for many unique post-processors to be developed and maintained for the life of the ATE. These post-processors supported the link from specific DATPGs to specific testers. The proliferation of unique formats and post-processors created logistical support problems and therefore identified a need for standardization. A DATPG and ATE independent output data format is required to limit the number of post-processors (one for each ATE) requiring life cycle support. The digital test interchange format (DTIF) was chosen because of its wide use and because it was becoming known in industry as the de facto standard.

This document provides the basis to standardize digital test information for use on ATE. The digital test information consists of the unit under test (UUT) Model information, Stimulus and Response data, Fault Dictionary data, and Probe data.

DTIF is unique from other standards such as IEEE P1450 (Draft 0.95, dated July 1998), 1 Draft Standard Test Interface Language (STIL) for Digital Test Vector Data, and IEEE Std 1029.1-1991, IEEE Standard for Waveform and Vector Exchange Specification (WAVES). STIL is being developed to standardize the output interface of existing computer-aided engineering (CAE) tools with the input interface of ATE for integrated circuit (IC) testing only. WAVES is a hardware descriptive language used for defining stimulus and response, and their associated timing for IC/board-level design. Neither STIL nor WAVES provides for board-level fault diagnostics.

A future revision of this standard will consider the use of the information model.

Scope

This standard defnes the information content and the data formats for the interchange of digital test program data between DATPGs and automatic test equipment (ATE) for board-level printed circuit assemblies. This information can be broadly grouped into data that defnes the following:

a) UUT Model;

b) Stimulus and Response;

c) Fault Dictionary;

d) Probe.