scope:

This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A.

The complete PIN is as shown in the following example:

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function Access time 01 (See 6.6) 64K × 4 CMOS SRAM 35 ns 02 (See 6.6) 64K × 4 CMOS SRAM 45 ns 03 (See 6.6) 64K × 4 CMOS SRAM 55 ns 04 (See 6.6) 64K × 4 CMOS SRAM 70 ns 05 (See 6.6) 64K × 4 CMOS SRAM 25 ns 06 (See 6.6) 64K × 4 CMOS SRAM 20 ns

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style L GDIP3-T24 or CDIP4-T24 24 dual-in-line package X CQCC3-N28 28 rectangular chip carrier package Y CDFP4-28 28 flat package

The lead finish is as specified in MIL-PRF-38535, appendix A.

Voltage on any input relative to V_SS range --------- −0.5 V dc to +7.0 V dc Voltage applied to outputs range -------------------- −0.5 V dc to +6.0 V dc Storage temperature range --------------------------- −65°C to + 150°C Maximum power dissipation (P_D) --------------------- 1.0 W Lead temperature (soldering, 10 seconds) ------------ +260°C Thermal resistance, junction-to-case (Θ_JC): Cases L and X -------------------------------------- See MIL-STD-1835 Junction temperature (T_J) -------------------------- +150°C 1/

Supply voltage range (V_CC) ------------------------ 4.5 V dc to 5.5 V dc Supply voltage range (V_SS) ------------------------- 0 V dc Input high voltage range (V_IH) ---------------------- 22 V dc to V_CC +0.5 V dc Input low voltage range (V_IL) ----------------------- −0.5 V dc to + 0.8 V dc 2/ Case operating temperature range (T_C) -------------- −55°C to +125°C

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.