scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 87C51 B-bit microcontroller with 4k-bytes EPROM memory. (3.5 to 12MHz) 02 87C51-16 8-bit microcontroller with 4k-bytes EPROM memory. (3.5 to 16MHz)

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

For device classes M, B, and S, case outline(s) shall meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-I-38535, appendix C of MIL-M-38510, and as listed below.

Outline letter Case outline U C-5 (44-lead, 0.662" × 0.662" × 0.120"), square chip carrier package 1/ Q D-5 (40-lead, 2.096" × 0.620 × 0.225"), dual-in-line package 1/

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finnish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation s for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Storage temperature range - - - - - - - - - - - - - −65°C to +150°C Voltage on [E bar][A bar]/V_PP pin to V_SS - - - - - - - - - - - 0 V dc to +13.0 dc Voltage on an pin to V_SS - - - - - - - - - - - - - −0.5 V dc to +6.5 V dc Power dissipation (P_D) - - - - - - - - - - - - - - 1.5 W Maximum junction temperature (T_J) - - - - - - - - - +200°C Lead temperature (soldering, 10 seconds) - - - - - +300°C Thermal resistance, junction-to-case (θ_JC) - - - - - See MIL-M-38510, appendix C

Supply voltage (V_CC) - - - - - - - - - - - - - - - - 5.0 V dc ±10% Case operating temperature range (T_C) - - - - - - - - −55°C to +125°C Maximum input low voltage (except [E bar][A bar]) - - - - - - - - 0.2V_CC − 0.25 V Maximum input low, voltage ([E bar][A bar]) - - - - - - - - - - - 0.2V_CC − 0.45 V Minimum input high voltage (except XTAL1, RESET)- - - 0.2V_CC + 1.1 V Minimum input high voltage (XTAL1 & RESET)- - - - - - 0.7V_CC + 0.2 V

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - XX percent 3/

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - 90 percent

intended Use: