scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following examples.

For device classes M and Q:

For device class V:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 AD570 8-bit A/D with three-state output 02 AD571 10-bit A/D with three-state output 03 AD571 10-bit A/D with three-state output

The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device.

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style V GDIP1-T18 or CDIP2-T18 18 dual-in-line

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Negative supply voltage (V_EE) to digital common ........................... −16.5 V dc Positive supply voltage (V_CC) to digital common ........................... +7 V dc Analog input voltage to analog common ..................................... ±15 V dc Digital input voltage to digital common ................................... 0 V dc to V_CC Digital output voltage to digital common .................................. 0 V dc to V_CC Analog return to digital common .......................................... ±1 V dc Power dissipation (T_A = 25°C) ............................................. 800 mW Lead temperature (soldering, 10 seconds) .................................. +300°C Storage temperature range ................................................ −65°C to +150°C Junction temperature (T_J) ................................................. +175°C Thermal resistance: θ_JC ....................................................................... See MIL-STD-1835 θ_JA ....................................................................... +88°C/W

Positive supply voltage range ............................................. +4.5 V dc to +5.5 V dc Negative supply voltage range ............................................. −13.5 V dc to −16.0 V dc Ambient operating temperature range ....................................... −55°C to + 125°C Minimum high-level input voltage .......................................... +2.0 V dc Maximum low-level input voltage ........................................... +0.8 V dc

intended Use: