This document references:
IPC-6011 - Generic Performance Specification for Printed Boards
Published by IPC
on
July 1, 1996
Statement of Scope This specification establishes the general requirements for printed boards and the quality and reliability assurance requirements that must be met for their acquisition. The intent...
This document references:
IPC-TM-650 2.6.7.3 - Thermal Shock - Solder Mask
Published by IPC
on
July 1, 2000
This test method is to determine the physical endurance of applied polymer solder mask to sudden changes of high and low temperature excursions to cause physical fatigue.
This document references:
TM-650 2.6.3.3B - Surface Insulation Resistance, Fluxes
Published by IPC
on
June 1, 2004
This test method is to characterize fluxes by determining the degradation of electrical insulation resistance of rigid printed wiring board specimens after exposure to the specified flux. This test...
This document is referenced by:
IPC-5703 - Cleanliness Guidelines for Printed Board Fabricators
Published by IPC
on
May 1, 2013
Introduction In many IPC standards development meetings, those individuals responsible for assessing the quality of incoming unpopulated printed boards have lamented the fact that bare printed board...