NPFC - MIL-M-38510/324
MICROCIRCUITS, DIGITAL, BIPOLAR, LOW-POWER SCHOTTKY, TTL, OCTAL BUFFER GATES WITH THREE STATE OUTPUTS, MONOLITHIC SILICON
| Organization: | NPFC |
| Publication Date: | 15 October 1987 |
| Status: | inactive |
| Page Count: | 35 |
scope:
This specification covers the detail requirements for monolithic silicon, TTL, low-power Schottky, octal bus buffer gates with three-state outputs. Two product assurance classes and a choice of case outlines and lead finishes are provided and are reflected in the complete part number.
The part number shall be in accordance with MIL-M-38510, and as specified herein.
The device types shall be as follows:
Device type Circuit 01 Inverting octal buffer gate (inverting control inputs) 02 Noninverting octal buffer gate (complementary control inputs) 03 Noninverting octal buffer gates (inverting control inputs) 04 Inverting octal buffer gate (inverting control inputs) 05 Noninverting octal buffer gates (inverting control inputs)
The device class shall be the product assurance level as defined in MIL-M-38510.
The case outlines shall be designated as follows:
Letter Case outline (see MIL-M-38510, appendix C) R D-8 (20-lead, ¼" × 1 1/16"), dual-in-line package S F-9 (20-lead, ¼" × ½"), flat package 2 C-2 (20 terminal, .350" × .350"), square chip carrier package X C-2A (20 terminal, .350" × .350"), square chip carrier package
Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Rome Air Development Center (RBE-2), Griffiss AFB, NY 13441, by using the self-addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter.
Supply voltage range- - - - - - - - - - - −0.5 V to +7.0 V Input voltage range - - - - - - - - - - - −1.5 V at −18mA to +5.5 V Storage temperature range - - - - - - - - −65°C to +150°C Maximum power dissipation (PD) 1/: Device type 01- - - - - - - - - - - - - 275 mW Device types 02 and 03- - - - - - - - - 297 mW Device type 04- - - - - - - - - - - - - 286 mW Device type 05- - - - - - - - - - - - - 302 mW Lead temperature (soldering, 10 seconds)- +300°C Thermal resistance, junction-to-case (OJC): Cases R, S, and X - - - - - - - - - - - See MIL-M-38510, appendix C Case 2- - - - - - - - - - - - - - - - - 60°C/W 2/ Junction temperature (TJ) 3/ - - - - - - +175°C
Low-level output current- - - - - - - - - 18 mA maximum High-level output current - - - - - - - - −12 mA maximum Supply voltage (VCC)- - - - - - - - - - - 4.5 V minimum to 5.5 V maximum Minimum high-level input voltage (VIH)- - 2.0 V Maximum low-level input voltage (VIL) - - 0.7 V Case operating temperature range (TC) - - −55°C to +125°C
intended Use:
Microcircuits conforming to this specification are intended for original equipment design applications and logistic support of existing equipment.
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