scope:

The classification procedure applies to all plastic IC Surface Mount Devices (SMDs) in packages that, because of absorbed moisture, could be sensitive to damage during solder reflow. These SMDs include plastic encapsulated packages and other packages made with moisture-permeable materials such as epoxies. The categories are intended to be used by SMD producers to inform users (board assembly operations) of the level of moisture sensitivity of product devices, and by board assembly operations to ensure that proper handling precautions are applied to moistweheflow sensitive devices.

PURPOSE

The purpose of this test method is to identify the classification level of plastic IC Surface Mount Devices (SMDs) that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid subsequent mechanical damage during the assembly solder reflow attachment and/or repair operation.

This test method may be used to determine what classification level should be used for initial reliability qualification.

If an initial qualification exists and no major changes have been made, this method may be used for reclassification to an improved level (longer floor life up to level 2). The reclassification level cannot be improved by more than one level without additional reliability testing.

No components classified as moisture sensitive by any previous version of JESD22-Al12 or IPC-SM-786 may be reclassified as nonmoisture sensitive (Level 1) without additional reliability stress testing (i.e., JESD22-A113 and JESD47 or the semiconductor manufacturer's in-house procedures).

Passing the reject criteria in this test method is not sufficient in itself to provide assurance of long term reliability.