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IPC/JEDEC J-STD-020

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

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Organization: IPC
Publication Date: 1 August 2007
Status: inactive
Page Count: 24
scope:

This classification procedure applies to all nonhermetic solid state Surface Mount Devices (SMDs) in packages, which, because of absorbed moisture, could be sensitive to damage during solder reflow. The term SMD as used in this document means plastic encapsulated surface mount packages and other packages made with moisture-permeable materials. The categories are intended to be used by SMD producers to inform users (board assembly operations) of the level of moisture sensitivity of their product devices, and by board assembly operations to ensure that proper handling precautions are applied to moisture/reflow sensitive devices. If no major changes have been made to a previously qualified SMD package, this method may be used for reclassification according to 4.2.

This standard cannot address all of the possible component, board assembly and product design combinations. However, the standard does provide a test method and criteria for commonly used technologies. Where uncommon or specialized components or technologies are necessary, the development should include customer/manufacturer involvement and the criteria should include an agreed definition of product acceptance.

SMD packages classified to a given moisture sensitivity level by using Procedures or Criteria defined within any previous version of J-STD-020, JESD22-A112 (rescinded), IPC-SM-786 (superseded) do not need to be reclassified to the current revision unless a change in classification level or a higher peak reflow temperature is desired.

Note: If the procedures in this document are used on packaged devices that are not included in this specification's scope, the failure criteria for such packages must be agreed upon by the device supplier and their end user.

Document History

December 1, 2022
Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs)
This classification procedure applies to all non-hermetic SMDs, which, because of absorbed moisture, could be sensitive to damage during solder reflow. The term SMD as used in this document means...
January 1, 2015
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
This classification procedure applies to all nonhermetic SMDs in packages, which, because of absorbed moisture, could be sensitive to damage during solder reflow. The term SMD as used in this...
August 1, 2007
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
This classification procedure applies to all nonhermetic solid state Surface Mount Devices (SMDs) in packages, which, because of absorbed moisture, could be sensitive to damage during solder reflow....
IPC/JEDEC J-STD-020
August 1, 2007
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
This classification procedure applies to all nonhermetic solid state Surface Mount Devices (SMDs) in packages, which, because of absorbed moisture, could be sensitive to damage during solder reflow....
July 1, 2004
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
This classification procedure applies to all nonhermetic solid state Surface Mount Devices (SMDs) in packages, which, because of absorbed moisture, could be sensitive to damage during solder reflow....
July 1, 2002
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
A description is not available for this item.
April 1, 1999
Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices
A description is not available for this item.
October 1, 1996
Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices
The classification procedure applies to all plastic IC Surface Mount Devices (SMDs) in packages that, because of absorbed moisture, could be sensitive to damage during solder reflow. These SMDs...

References

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