scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Harness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and an marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 CLC431 Wideband, current feedback, dual, operational amplifier with disable 02 CLC432 Wideband, current feedback, dual, operational amplifier

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 complaint, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification of MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage (V_S)....................................... ±16.5 V dc Output current (I_OUT)..................................... 100 mA Common mode input voltage (V_CM)........................... ±V_S Differential input voltage (V_ID).......................... ±10 V Power dissipation (P_D).................................... 1.15 W Lead temperature (soldering, 10 seconds).................. +300°C Junction temperature (T_J)................................. +200°C Storage temperature range................................. −65°C to +150°C Thermal resistance, junction-to-case (θ_JC): Cases C and P........................................... See MIL-STD-1835 Case 2.................................................. 25°C/W Thermal resistance, junction-to-ambient (θ_JA): Case C.................................................. 80°C/W Case P.................................................. 115°C/W Case 2.................................................. 40°C/W

Supply voltage (V_S)....................................... ±15 V dc Gain range (A_V)........................................... ±1 V/V to ±10 V/V Ambient operating temperature range (T_A).................. −55°C to +125°C

intended Use: