DOD - SMD 5962-92344
MICROCIRCUIT, MEMORY, DIGITAL, BICMOS, 8K X 8 RESETTABLE SRAM, MONOLITHIC SILICON
| Organization: | DOD |
| Publication Date: | 16 December 1993 |
| Status: | inactive |
| Page Count: | 23 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number 1/ Circuit function Access time 01 71B74 8K × 8 SRAM, resettable 20 ns
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style X CQCC1-N32 32 Rectangular leadless chip carrier
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage (VCC) . . . . . . . . . . . . . . . . . −0.5 V to +7.0 V Voltage on any pin with respect to GND (VTERM) range. . −0.5 V to +7.0 V 3/ Storage temperature range . . . . . . . . . . . . . . . −65°C to +150°C Thermal resistance, junction-to-case (ΘJC). . . . . . . 20°C/W Junction temperature . . . . . . . . . . . . . . . . . 150°C Power dissipation . . . . . . . . . . . . . . . . . . . 1.0 W DC output current . . . . . . . . . . . . . . . . . . . 50 mA Terminal soldering, temperature range (10 seconds). . . 275°C
Supply voltage range . . . . . . . . . . . . . . . . . 4.5 V dc to 5.5 V dc High level input voltage range (VIH). . . . . . . . . . 2.2 V dc to 6.0 V dc 3/ 4/ Low level input voltage range (VIL) . . . . . . . . . . −0.5 V dc to +0.8 V dc 5/ Case operating temperature range (TC) . . . . . . . . . −55°C to +125°C
Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . 6/ percent
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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