DLA - SMD-5962-85064 REV G
MICROCIRCUIT, DIGITAL, CMOS 8-BIT CONTROL-ORIENTED MICROCOMPUTER/MICROCONTROLLER, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 18 December 1992 |
| Status: | inactive |
| Page Count: | 30 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 80C31BH CMOS 8-bit microcontroller (3.5 to 12 MHz) 02 80C51BH CMOS 8-bit microcontroller with a mask programmable R0M (3.5 to 12 MHz) 03 80C31BH-16 CMOS 8-bit microcontroller (3.5 to 16 MHz) 04 80C51BH-16 CMOS 8-bit microcontroller with a mask programmable ROM (3.5 to 16 MHz)
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535
For device classes M, B, and S, case outline(s) shall meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-I-38535, appendix C of MIL-M-38510, and as listed below.
Outline letter Case outline Q D-5 (40-lead, 2.096" × 0.620" × 0.225"), dual-in-line package X C-5 (44-lead, 0.662" × 0.662" × 0.120"), square chip carrier package Y 52-lead (1.330" × 0.660" × 0.100"), flat package (see figure 1)
The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage range (referenced to ground) - - - - - 6.5 V dc maximum Maximum power dissipation - - - - - - - - - - - - - - 200 mW Voltage (any pin) to VSS - - - - - - - - - - - - - - - −0.5 V dc to VCC +0.5 V dc Storage temperature- - - - - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 5 seconds)- - - - - - - - +300°C Maximum junction temperature (TJ)- - - - - - - - - - - +200°C Thermal resistance, junction-to-case (θJC): Case outlines Q and X - - - - - - - - - - - - - - - See MIL-M-38510, appendix C Case outline Y - - - - - - - - - - - - - - - - - - - 20°C/W
Supply voltage (VCC) - - - - - - - - - - - - - - - - - 4 V dc to 6 V dc Maximum low-level input voltage (except EA)- - - - - - 0.2 VCC − 0.25 V dc (EA) - - - - - - - - - - - - - - - - - - - - - - - - 0.2 VCC − 0.45 V dc Minimum high-level input voltage (except XTAL1, RST) - 0.2 VCC + 1.1 V dc (XTA1, RST)- - - - - - - - - - - - - - - - - - - - - 0.7 VCC + 0.2 V dc Case operating temperature range (TC)- - - - - - - - - −55°C to +125°C Oscillator frequency: Device types 01 and 02 - - - - - - - - - - - - - - - 3.5 MHz to 12 MHz Device types 03 and 04 - - - - - - - - - - - - - - - 3.5 MHz to 16 MHz
Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012)- - - - - XX percent 2/
Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012)- - - - - 90 percent
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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