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DLA - SMD-5962-89747

MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, HEX INVERTER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON

inactive
Organization: DLA
Publication Date: 24 October 1989
Status: inactive
Page Count: 10
scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 MIL-STD-883, Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device type shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54HCT04 Hex inverter, TTL compatible inputs

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline C D-1 (14-lead, .785" × .310" × .200"), dual-in-line package 2 C-2 (20-terminal, .358" × .358" × .100"), square chip carrier package

Supply voltage range - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc DC input voltage range - - - - - - - - - - - - - −0.5 V dc to VCC + 0.5 V dc DC output voltage range - - - - - - - - - - - - −0.5 V dc to VCC + 0.5 V dc Input diode current - - - - - - - - - - - - - - ±20 mA DC output diode current (per pin) - - - - - - - ±20 mA DC drain current (per pin) - - - - - - - - - - - ±25 mA DC VCC or GND current - - - - - - - - - - - - - ±50 mA Storage temperature range - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (PD) - - - - - - - - - 500 mW 2/ Lead temperature (soldering, 10 seconds) - - - - +300°C Thermal resistance, Junction-to-case (θJC) - - - See MIL-M-38510, appendix C Junction temperature (TJ) - - - - - - - - - - - +175°C

Supply voltage range (VCC) - - - - - - - - - - - +4.5 V dc to +5.5 V dc Case operating temperature range (TC) - - - - - - −55°C to +125°C Input rise or fall time (tr, tf) - - - - - - - - - 0 to 500 ns

intended Use:

Microcircuits conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for... View More

Document History

March 22, 2022
MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, HEX INVERTER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead...
January 27, 2016
MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, HEX INVERTER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device class Q and M) and space application (device class V). A choice of case outlines and lead finishes are...
March 8, 2010
MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, HEX INVERTER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
September 11, 2003
MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, HEX INVERTER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
A description is not available for this item.
December 19, 2002
MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, HEX INVERTER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
A description is not available for this item.
SMD-5962-89747
October 24, 1989
MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, HEX INVERTER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 MIL-STD-883, Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". The...

References

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