scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 LMC6462A Precision CMOS dual micropower operational amplifier 02 LMC6464A Precision CMOS quad micropower operational amplifier

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line P GDIP1-T8 or CDIP2-T8 8 Dual-in-line X See figure 1 14 Flat pack

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage (V+ - V−). ............................................................ 16 V Differential input voltage ........................................................... ±Supply voltage Voltage at input/output pin .......................................................... (V+) + 0.3 V, (V−) − 0.3 V Current at input pin ..................................................................±5 mA 2/ Current at output pin ................................................................ ±30 mA 3/ 4/ Current at power supply pin .......................................................... 40 mA Storage temperature range ............................................................ −65°C to +150°C Maximum power dissipation (P_D): Device type 01 ..................................................................... 3 mW Device type 02 ..................................................................... 6 mW Lead temperature (soldering, 10 seconds) ............................................. +260°C Junction temperature (T_J) ............................................................ +150°C 3/ Thermal resistance, junction-to-case (θ_JC): 5/ Case outlines C and X .............................................................. 8°C/W Case outline P ..................................................................... 14°C/W Thermal resistance, junction-to-ambient (θ_JA): 5/ Case outline C ..................................................................... 74°C/W still air 37°C/W 500 LFPM Case outline P ..................................................................... 122°C/W still air 67°C/W 500 LFPM Case outline X ..................................................................... 132°C/W still air 78°C/W 500 LFPM

Supply voltage ....................................................................... +3.0 V to + 15.5 V Ambient operating temperature range (T_A) ............................................. −55°C to + 125°C

intended Use: