DLA - SMD-5962-95603
MICROCIRCUIT, LINEAR, CMOS, PRECISION, DUAL/QUAD, MICROPOWER, OPERATIONAL AMPLIFIER, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 25 April 1996 |
| Status: | inactive |
| Page Count: | 14 |
scope:
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) identify the circuit function as follows:
Device type Generic number Circuit function 01 LMC6462A Precision CMOS dual micropower operational amplifier 02 LMC6464A Precision CMOS quad micropower operational amplifier
The device class designator is a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535
The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line P GDIP1-T8 or CDIP2-T8 8 Dual-in-line X See figure 1 14 Flat pack
The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.
Supply voltage (V+ − V−) . . . . . . . . . . . . . . . . . 16 V Differential input voltage . . . . . . . . . . . . . . . . ±Supply voltage Voltage at input/output pin . . . . . . . . . . . . . . . (V+) + 0.3 V, (V−) − 0.3 V Current at input pin . . . . . . . . . . . . . . . . . . . ±5 mA 2/ Current at output pin . . . . . . . . . . . . . . . . . . ±30 mA 3/ 4/ Current at power supply pin . . . . . . . . . . . . . . . 40 mA Storage temperature range . . . . . . . . . . . . . . . . −65°C to +150°C Maximum power dissipation (PD): Device type 01 . . . . . . . . . . . . . . . . . . . . 3 mW Device type 02 . . . . . . . . . . . . . . . . . . . . 6 mW Lead temperature (soldering, 10 seconds) . . . . . . . . . +260°C Junction temperature (TJ) . . . . . . . . . . . . . . . . +150°C 3/ Thermal resistance, junction-to-case (θJC): 5/ Case outlines C and X . . . . . . . . . . . . . . . . . 8°C/W Case outline P . . . . . . . . . . . . . . . . . . . . 14°C/W Thermal resistance, junction-to-ambient (θJA): 5/ Case outline C . . . . . . . . . . . . . . . . . . . . 74°C/W still air 37°C/W 500 LFPM Case outline P . . . . . . . . . . . . . . . . . . . . 122°C/W still air 67°C/W 500 LFPM Case outline X . . . . . . . . . . . . . . . . . . . . 132°C/W still air 78°C/W 500 LFPM
Supply voltage . . . . . . . . . . . . . . . . . . . . . . +3.0 V to +15.5 V Ambient operating temperature range (TA) . . . . . . . . −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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