scope:

This drawing forms a pant of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA mark devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Access time 01 20RA10 20-input, 10-output, multiple clock, architecturally 25 ns generic, EECMOS, programmable AND/OR array 02 20RA10 20-input, 10 output, multiple clock, architecturally 20 ns generic, EECMOS, programmable AND/OR array

The device class designator shaft be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-M-38510 B or S Certification and qualification to MIL-I-38510 Q of V Certification and qualification to MIL-I-38515

The case outline(s) shall be as designate in MIL-STD-1815 and as follows:

Outline letter Descriptive designator Terminals Package style L GDIP3-T24 of CDIP4-T24 24 Dual-in-line 3 CQCC1-N28 28 Square leadless chip carrier

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S of MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is fop use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC) - - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc Input voltage applied - - - - - - - - - - - - - - - - - - - −2.5 V dc to V_CC + 1.0 V dc Off-state output voltage applied- - - - - - - - - - - - - - −2.5 V dc to V_CC + 1.0 V dc Storage temperature range - - - - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds) - - - - - - - - - +260°C Thermal resistance, junction-to-case (θ_JC)- - - - - - - - - See MIL-STD-1835 Maximum power dissipation (P_D) 2/ - - - - - - - - - - - - - 1.3 watts Junction temperature (T_J) - - - - - - - - - - - - - - - - - +175°C Endurance - - - - - - - - - - - - - - - - - - - - - - - - - 100 erase/write cycles (minimum) Data retention - - - - - - - - - - - - - - - - - - - - - - 10 years minimum

Supply voltage range (V_CC) - - - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc High level input voltage range (V_IH)- - - - - - - - - - - - 2.0 V dc to V_CC + 1.0 V dc Low level input voltage range (V_IL) - - - - - - - - - - - - V_SS − 0.5 V dc to 0.8 V dc High level output current (I_OH) - - - - - - - - - - - - - - −3.2 mA maximum Low level output current (I_OL)- - - - - - - - - - - - - - - 8.0 mA maximum Case operating temperature range (T_C) - - - - - - - - - - - −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) 3/ percent

intended Use: