scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash(-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 LM6162 High speed operational amplifier

The device class designator is a single letter identifying the product assurance level as follows:

Device type Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style H GDFP1-F10 or CDFP2-F10 10 Flat pack P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier X See figure 1 10 Flat pack

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage (+V_S to −V_S) ............................................. 36 V dc Differential input voltage............................................... ±8 V dc 2/ Common mode voltage range................................................ (+Vs −0.7 V dc) to (+Vs −0.3 V dc) Output short circuit to GND.............................................. Continuous 3/ Operating supply voltage range........................................... 4.75 V dc to 32 V dc Storage temperature range................................................ −65°C to +150°C Lead temperature (soldering, 10 seconds)................................. +260°C Junction temperature (T_J)................................................ +150°C Power dissipation (P_D)................................................... 400 mW Thermal resistance, junction-to-case (θ_JC): Cases H, P, and X...................................................... 21°C/W Case 2................................................................. 20°C/W Thermal resistance, junction-to-ambient (θ_JA): Case H and X........................................................... 228°C/W (still air, board mount) 140°C/W (500 LFPM air flow mount) Case P................................................................. 113°C/W (still air, board mount) 51°C/W (500 LFPM air flow mount) Case 2................................................................. 90°C/W (still air, board mount) 61°C/W (500 LFPM air flow mount)

Positive supply voltage (+V_S)........................................... +15 V dc Negative supply voltage (−V_S)........................................... −15 V dc Phase margin............................................................ 45° Differential gain....................................................... 0.1% Differential phase...................................................... 0.1° Power bandwidth......................................................... 4.5 MHz Input noise voltage..................................................... 10 nV/ Input noise current..................................................... 1.2 pA/ Ambient operating temperature range (T_A)................................ −55°C to +125°C

intended Use: