scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash(-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 LM6162 High speed operational amplifier

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style H GDFP1-F10 or CDFP2-F10 10 Flat pack P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier X See figure 1 10 Flat pack

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage (+V_s to −V_s)............................36 V dc Differential input voltage..............................±8 V dc 2/ Common mode voltage range..............................(+Vs −0.7 V dc) to (+Vs −0.3 V dc) Output short circuit to GND............................Continuous 3/ Operating supply voltage range.........................4.75 V dc to 32 V dc Storage temperature range..............................−65°c to +150°C Lead temperature (soldering, 10 seconds)...............+260°C Junction temperature(T_J)...............................+150°C Power dissipation (P_D).................................400mW Thermal resistance, junction-to-case(θJC): Cases H, P, and X....................................21°C/W Case 2...............................................20°C/W Thermal resistance, junction-to-ambient(θJA): Case H and X.........................................228°C/W (still air, board mount) 140°C/W (500 LFPM air flow mount) Case P...............................................113°C/W (still air, board mount) 51°C/W (500 LFPM air flow mount) Case 2...............................................90°C/W (still air, board mount) 61°C/W (500 LFPM air flow mount)

Positive supply voltage (+Vs)............+15 V dc Negative supply voltage (−Vs)............−15 V dc Phase margin.............................45° Differential gain........................0.1% Differential phase.......................0.1° Power bandwidth..........................4.5 MHz Input noise voltage......................10 nV/ Input noise current......................1.2pA/ Ambient operating temperature range(T_A)..−55°C to +125°C

intended Use: