scope:

This drawing documents five product assurance classes, class D (lowest reliability), class E, (exceptions), class G (lowest high reliability), class H (high reliability), and class K, (highest reliability) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes H and K RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 MSK 158B, MSK 159B High voltage, MOSFET operational amplifier 02 MSK 162B, MSK 163B High voltage, MOSFET operational amplifier 03 MSK 164B, MSK 167B High voltage, MOSFET operational amplifier

This device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device performance documentation D, E, G, H, or K Certification and Qualification to MIL-PRF-38534

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style U See figure 1 8 Dual-in-line (Z tab power) X See figure 1 24 Quad ceramic flat pack Y See figure 1 8 Dual-in-line (power) Z See figure 1 14 Dual-in-line

The lead finish shall be as specified in MIL-PRF-38534.

Supply voltage (total V_CC) ................................... 350 V dc 2/ Commom mode input voltage range .............................. ±V_CC Differential input voltage ................................... ±16 V dc Output current (within SOA continuous) ....................... 60 mA Lead temperature (soldering, 10 seconds) ..................... +300°C Junction temperature (T_J) .................................... +150°C Thermal resistance, junction-to-case (θ_JC): Case outlines U and Y ...................................... 10°C/W Case outline X ............................................. 15°C/W Case outline Z ............................................. 12°C/W Storage temperature range .................................... −65°C to +150°C Case operating temperature (T_C) .............................. −55°C to +125°C

Supply voltage (V_CC) ................................................ ±50 V dc to ±170 V dc Offset pot (device type 03, only) ................................... 200 kohm to −V_CC Current limit equation .............................................. I_LIM = 3/R_CL Output snubber network .............................................. 100 ohms/330 pF Ambient operating temperature (T_A) ................................. −55°C to +125°C

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.