scope:

This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with MIL-PRF-38534.

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device types Generic number Circuit function 01 BUS-65142, BUS-65144, Dual redundant remote terminal unit (RTU) 02 BUS-65143, BUS-65145, Dual redundant remote terminal unit (RTU) 03 CT2542, CT2542-FP Dual redundant remote terminal unit (RTU) 04 CT2543, CT2543-FP Dual redundant remote terminal unit (RTU)

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X See figure 1 78 Hybrid package Y See figure 1 82 Flat package

The lead finish shall be as specified in MIL-PRF-38534.

Logic supply voltage (V_L) ............................. 5.5 V dc Negative supply voltage (V_EE) ......................... −18.0 V dc Storage temperature range ............................. −65°C to +150°C Thermal rise, case to junction (ΔT_J) .................. 13.9°C Lead soldering temperature (10 seconds) ............... +300°C Power dissipation (T_C = +125°C) ....................... Duty cycle dependent (see table I power supplies)

Logic supply voltage (V_L) ............................. +4.5 V dc to +5.5 V dc Negative supply voltage (V_EE): Device types 01 and 03 ............................... −14.25 V dc to −15.75 V dc Device types 02 and 04 ............................... −11.4 V dc to −12.6 V dc Case operating temperature range (T_C) ................. −55°C to +125°C Maximum differential input voltage .................... 40 Vp-p

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.