scope:

This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with MIL-H-38534.

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 BUS-65142, BUS-65144 Dual redundant remote terminal unit (RTU) 02 BUS-65143, BUS-65145 Dual redundant remote terminal unit (RTU)

The case outline(s) shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline X See figure 1, (78-lead, 2.100" × 1.870" × .250"), hybrid package Y See figure 1, (82-lead, 2.195" × 1.605" × .186"), flat package

Logic supply voltage (V_L) - - - - - - - - - - - - 5.5 V dc Negative supply voltage (V_EE) - - - - - - - - - - −18.0 V dc Storage temperature range - - - - - - - - - - - - −65°C +150°C Thermal rise, case-to-junction (ΔT_J)- - - - - - - −8.53°C Lead soldering temperature (10 seconds) - - - - - +300°C Power dissipation (T_C = +125°C) - - - - - - - - - Duty cycle dependent (see table I power supplies)

Logic supply voltage (V_L) - - - - - - - - - - +4.5 v dc to +5.5 V dc Negative supply voltage (V_EE): Device type 01 range- - - - - - - - - - - - - −14.25 V dc to −15.75 V dc Device type 02 range- - - - - - - - - - - - - −11.4 V dc to −12.6 V dc Case operating temperature range (T_C) - - - - −55°C to +125°C Maximum different input voltage - - - - - - - 40 V_P−P

intended Use:

Microcircuits conforming to this drawing are intended for original equipment design applications and logistic support of existing equipment.