scope:

This drawing form a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V) and choice of case outlines end lead finishes are available and are reflected in the Part or identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked device shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non RHA device.

The device type(s) fill identify the circuit function as follows:

Device type Generic number 1/ Circuit function Access time 01 32K × 8 PROM 55 ns 02 32K × 8 PROM 45 ns 03 32K × 8 PROM 35 ns 04 32K × 8 PROM 55 ns 05 32K × 8 PROM 45 ns 06 32K × 8 PROM 35 ns

The device class designator shall be single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X GDIP4-T28 or CDIP3-T28 28 Dual-in-line Y GDFP2-F28 28 Flat pack Z CQCC1-N32 32 Rectangular leadless chip carrier U GDIP1-T28 or CDIP2-T28 28 Dual-in-line

The Lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range - - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc DC voltage applied to outputs in high Z state - - - −0.5 V dc to +7.0 V dc DC input voltage - - - - - - - - - - - - - - - - - - −3.0 V dc to +7.0 V dc DC program voltage - - - - - - - - - - - - - - - - - 13.0 V dc Maximum power dissipation (P_D) - - - - - - - - - - - 1.0 W 3/ Lead temperature (soldering, 10 seconds maximum) - - +260°C Thermal resistance, junction-to-case (O_JC) - - - - - See MIL-STD-1835 Junction temperature (T_J) - - - - - - - - - - - - - +175°C Storage temperature range- - - - - - - - - - - - - - −65°C to +150°C Temperature under bias - - - - - - - - - - - - - - - −55°C to +125°C Data Retention - - - - - - - - - - - - - - - - - - - 10 years/minimum

Supply voltage (V_CC) - - - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc Ground voltage (GND) - - - - - - - - - - - - - - - - 0.0 V DC Input high voltage (V_IH) - - - - - - - - - - - - - - 2.0 V dc minimum Input low voltage (V_IL) - - - - - - - - - - - - - - 0.8 V dc maximum Case operating temperature range (T_C) - - - - - - - −55°C to +125°C

Fault coverage measurement of manufacturing Logic tests (MIL-STD-883, test method 5012) XX percent 4/

intended Use: