scope:

This specification establishes the qualification and performance requirements for a metal core packaging interconnection (P/I) structure, hereafter referred to as a metal core board. Metal core boards consist of at least one conductive pattern on each side of an insulated metal substrate. Interconnection between conductive patterns shall be made using plated-through holes. The metal substrate shall be an integral part of the metal core board prior to interconnecting the conductive pattern.

Purpose. The purpose of this specification is to provide classes of requirements for performance/acceptance of metal core boards for industry and government use.