scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 LT1001, OP-77B Precision operational amplifier 02 OP-77A Precision operational amplifier 03 LT1001A Precision operational amplifier

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style G MACY1-X8 8 Can P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 2 CQCCl-N20 20 Square leadless chip carrier

The lead finish shall be as specified in MIL-M-38510. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage . . . . . . . . . . . . . . . . . . ±22.0 V dc Internal power dissipation . . . . . . . . . . . . 500 mW Input voltage 1/ . . . . . . . . . . . . . . . . . ±22.0 V dc Differential input voltage . . . . . . . . . . . . ±30 V dc Output short-circuit duration . . . . . . . . . . . Indefinite Lead temperature (soldering 10 seconds) . . . . . . +300°C Storage temperature range . . . . . . . . . . . . . −65°C to +150°C Thermal resistance, junction-to-case (Θ_JC) . . . . . See MIL-STD-1835 Thermal resistance, junction-to-ambient (Θ_JA): Case G . . . . . . . . . . . . . . . . . . . . . +150°C/W Case P . . . . . . . . . . . . . . . . . . . . . +119°C/W Case 2 . . . . . . . . . . . . . . . . . . . . . +110°C/M Junction temperature (T_J) . . . . . . . . . . . . . +150°C

Supply voltage range . . . . . . . . . . . . . . . ±3 V dc to ±18 V dc Ambient operating temperature range (T_A) . . . . . −55°C to +125°C

intended Use: