DLA - SMD-5962-87679 REV E
MICROCIRCUIT, HYBRID, LINEAR, DUAL AND QUAD CHANNEL, OPTICALLY COUPLED ISOLATOR
| Organization: | DLA |
| Publication Date: | 2 August 1993 |
| Status: | inactive |
| Page Count: | 15 |
scope:
This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with MIL-H-38534.
The complete PIN shall be as shown in the following example:
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 4N55, 66024 Dual channel, optocoupler with separate supply voltage and ground connections 02 HCPL-5531 Dual channel, optocoupler with common supply voltage and ground connections 03 HCPL-6531, Dual channel, optocoupler with separate supply 66125 voltage connections
The case outlines shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style E CDIP2-T16 16 Dual-in-line P CDIP2-T8 8 Dual-in-line T See figure 1 16 Dual-in-line U See figure 1 16 Dual-in-line X See figure 1 8 Dual-in-line Y See figure 1 8 Dual-in-line 2 CQCC1-N20 20 Square lead less chip carrier
The lead finish shall be as specified in MIL-H-38534. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage range (each channel) . . . . . . . . . . . . . . . . −0.5 V dc to +20 V dc Output voltage range (each channel) . . . . . . . . . . . . . . . . −0.5 V dc to +20 V dc Reverse input voltage (each channel) Device type 01 . . . . . . . . . . . . . . . . . . . . . . . . . 5.0 V dc Device types 02 and 03 . . . . . . . . . . . . . . . . . . . . . 3.0 V dc Output current (each channel) . . . . . . . . . . . . . . . . . . . 8 mA dc Input current (each channel) . . . . . . . . . . . . . . . . . . . 20 mA dc Peak input current (each channel ≤ 1 ms duration 500 pps) . . . . . 40 mA dc Emitter base reverse voltage (each channel) 2/ . . . . . . . . . . 3.0 V dc Output power dissipation (each channel) 3/ . . . . . . . . . . . . 50 mW Input power dissipation (each channel) . . . . . . . . . . . . . . 36 mW Storage temperature range . . . . . . . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) 4/ . . . . . . . . . . . . +260°C Junction temperature (TJ) . . . . . . . . . . . . . . . . . . . . . +150°C
Supply voltage range (VCC) (each channel) . . . . . . . . . . . . . 2.0 V dc minimum to 18.0 V dc maximum Low level input current (each channel) . . . . . . . . . . . . . . 250 µA dc maximum Operating temperature range (TC) . . . . . . . . . . . . . . . . . −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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