scope:

This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL- PRF-38535, appendix A.

The complete PIN is as shown in the following example:

The Device(s) identify the circuit function as follows:

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat package X CDFP4-F16 16 Flat-package 2 CQCC1-N20 20 Square chip carrier

The lead finish is as specified in MIL-PRF-38535, appendix A.

Supply voltage range(V_EE)........................... −8.0 V dc to 0.0 V dc Input voltage range................................. −5.2 V dc to 0.0 V dc Storage temperature range........................... −65°C to +165° C Lead temperature (soldering 10 seconds)............. +300° C Junction temperature(T_J)............................ +165° C Maximum power dissipation(P_D) ...................... 520 mW Thermal resistance, junction-to-case(Θ_JC)........... See MIL-STD-1835

Supply voltage range(V_EE)..................... −5.46 V dc minimum to −4.94 V dc maximum Supply voltage range(V_CC)..................... −0.02 V dc to +0.02 V dc or +1.98 V dc to +2.02 V dc Ambient operating temperature range(T_A)....... −55° C to + 125° C Minimum high level input voltage(V_IH): T_A = +25° C................................ −0.780 V dc T_A = +125° C............................... −0.650 V dc T_A = −55° C................................ −0.840 V dc Maximum low level input voltage(V_IL).......... −1.950 V dc

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.