IPC - TM-650 2.4.9D
Peel Strength, Flexible Printed Wiring Materials
inactive
| Organization: | IPC |
| Publication Date: | 1 October 1988 |
| Status: | inactive |
| Page Count: | 5 |
scope:
This test method defines the procedure for determining the bond strength of copper foil clad flexible dielectric material.
Document History
April 1, 2014
Peel Strength, Flexible Dielectric Materials
This test method defines the procedure for determining the bond strength of metal foils that are 18 microns thick or greater clad flexible dielectric material as nominally defined being measured with...
TM-650 2.4.9D
October 1, 1988
Peel Strength, Flexible Printed Wiring Materials
This test method defines the procedure for determining the bond strength of copper foil clad flexible dielectric material.