DLA - SMD-5962-87682 REV D
MICROCIRCUIT, MEMORY, DIGITAL, BIPOLAR 18 X 42 X 10 FIELD PROGRAMMABLE LOGIC ARRAY (FPLA), MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 16 June 1992 |
| Status: | inactive |
| Page Count: | 22 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with complaint non-JAN devices". When available, a choice of radiation hardness assurance (RHA) Levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 82S153A 18 × 42 × 10 field programmable logic array
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-N-38510 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style R CDIP3-T20 20 dual in-line package S CDFP5-F20 20 flat package 2 CQCC1-N20 20 square chip carrier package
The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C, are considered acceptable and interchangeable without preference.
Supply voltage range (VCC) - - - - - - - - - - - 7.0 V dc Input voltage range (VI) - - - - - - - - - - - - 10 V dc Storage temperature range - - - - - - - - - - - −65° to +150°C Maximum power dissipation 2/ - - - - - - - - - - 900 mW Lead temperature (soldering, 10 seconds) - - - - +300°C Thermal resistance, junction-to-case (θJC): Cases R, S, and 2 - - - - - - - - - - - - - - See MIL-STD-1835 Junction temperature (TJ) - - - - - - - - - - - +200°C Output sink current - - - - - - - - - - - - - - 100 mA
Supply voltage range (VCC) - - - - - - - - - - - - 4.5 V dc to 5.5 V dc Case operating temperature range (TC) - - - - - - −55°C to +125°C Minimum high level input voltage (VIH) - - - - - - 2.0 V dc Maximum low level input voltage (VIL) - - - - - - 0.8 V dc
Fault coverage measurement of manufacturing Logic tests (MIL-STD-883, test method 5012) - - - - - - 3/ percent
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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