scope:

This drawing documents has two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following examples.

For device classes M and Q:

For device class V:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 UT1553 BCRT Bus controller remote terminal

The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device.

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style T CQCC1-F132 132 Leaded chip carrier with unformed leads X CMGA15-P84 84 Pin grid array Y CQCC2-J84 84 Leaded chip carrier with unformed leads Z CQCC1-N84 84 Square chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range ..................................... −0.3 V dc to +7.0 V dc DC input/dc output voltage range ........................ −0.3 V dc to (V_CC) +0.3 V dc Storage temperature range................................. −65°C to +150°C Maximum power dissipation (P_D) 2/ ........................ 300 mW Maximum junction temperature (T_J)......................... +175°C Thermal resistance, junction-to-case (θ_JC) .............. See MIL-STD-1835 Latchup immunity (I_LU) ................................... ±150 mA Output short-circuit current (I_OS): A(0-15), D(0-15), [D bar][M bar][A bar][R bar], [D bar][M bar][A bar][C bar][K bar], [S bar][T bar][D bar][I bar][N bar][T bar][L bar], and [H bar][P bar][I bar][N bar][T bar] ...... 100 mA All other outputs ...................................... 200 mA

Supply voltage (V_DD).................................................. 4.5 V dc to 5.5 V dc Case operating temperature range (T_C) ................................ −55°C to +125°C Radiation features: Total dose ........................................................ ≥ 1 × 10⁶ Rads (Si) Single event phenomenon (SEP) effective linear energy threshold, no upsets or latchup (see 4.4.4.4)...... ≥ 55 MEV/(mg/cm²) Dose rate upset (20 ns pulse) ..................................... 3/ Dose rate latchup ................................................. 3/ Dose rate survivability ........................................... 3/ Neutron irradiated ............................................... > 1 × 10¹⁴

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) ................................ 86.5 percent

intended Use: