scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Access time Endurance 01 29C040 512K × 8 CMOS 5-VOLT PROGRAMMING EEPROM 200 ns 1000 cycles 02 29C040 512K × 8 CMOS 5-VOLT PROGRAMMING EEPROM 150 ns 1000 cycles

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X GDIPl-T32 or CDIP2-T32 32 Dual-in-line Y CDFP1-F32 32 flat package

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish Letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC) 2/ . . . . . . . . . . . . . . . . . −0.5 V dc to +6.0 V dc Voltage on any pin with-respect to ground 2/ . . . . . . . . . . −0.5 V dc to +6.0 V dc Voltage on pin A₉ and [O bar][E bar] with respect to ground 3/ . . . . . . . −0.5 V dc to +13.5 V dc Storage temperature range . . . . . . . . . . . . . . . . . . . . −65°C to +150°C Maximum power dissipation (P_D) . . . . . . . . . . . . . . . . . . 1.0 W Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . +300°C Junction temperature (T_J) 4/ . . . . . . . . . . . . . . . . . . +150°C Thermal resistance, junction-to-case (Θ_JC) . . . . . . . . . . . See MIL-STD-1835 Data retention . . . . . . . . . . . . . . . . . . . . . . . . . . 20 years minimum Endurance . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000 cycles/sector,minimum

Supply voltage range (V_CC) . . . . . . . . . . . . . . . . . . . . . +4.5 V dc to +5.5 V dc Case operating temperature range (T_C) . . . . . . . . . . . . . . . −55°C to +125°C Low level input voltage range (V_IL) . . . . . . . . . . . . . . . . −0.5 V dc to +0.8 V dc High level input voltage range (V_IH1) . . . . . . . . . . . . . . . +2.0 V dc to V_CC +0.5 V dc High level input voltage range (_VIH2) . . . . . . . . . . . . . . . V_CC −0.5 V dc to V_CC+0.5 V dc Chip clear voltage (V_H) . . . . . . . . . . . . . . . . . . . . . . +12.0 ± 0.5 V dc

Fault coverage measurement of manufacturing Logic tests (MIL-STD-883, test method 5012) . . . . . . . . . . . XX percent 6/

intended Use: