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DLA - SMD-5962-94758

MICROCIRCUIT, DIGITAL, SERIAL MICROCODED MULTI-MODE INTELLIGENT TERMINAL, SILICON

inactive
Organization: DLA
Publication Date: 28 March 1995
Status: inactive
Page Count: 48
scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 69151XT15 Serial microcoded monolithic multi-mode intelligent terminal with +5 V/−15 V operation 02 69151XT5 Serial microcoded monolithic multi-mode intelligent terminal with +5 V operation 03 69151XT12 Serial microcoded monolithic multi-mode intelligent terminal with +5 V/−12 V operation

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X See figure 1 139 Pin grid array Y See figure 1 140 Quad flat package

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Operating case temperature range (TC) . . . . . . . . . . . . . . . . . . . . . . . −55°C to +125°C Lead temperature (soldering, 5 seconds) (TS) . . . . . . . . . . . . . . . . . . . . +300°C Transceiver supply voltage (VEE): Devices 01, 03 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −22 V dc Transceiver supply voltage range (VCC): Device 02 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V dc to +7.0 V dc Logic supply voltage range (VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V dc to +7.0 V dc Receiver common mode input voltage range (VIC): Devices 01, 03 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −11 V dc to +11 V dc Device 02 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −5 V dc to +5 V dc Logic input current (II) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±10 mA Latch-up immunity (ILU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±150 mA Peak output current transmitter (IO): Devices 01, 03 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190 mA Device 02 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000 mA Logic voltage on any pin range (VI/O). . . . . . . . . . . . . . . . . . . . . . . . −0.3 V dc to VDD + 0.3 V dc Input voltage range receiver (VDR): Devices 01, 03 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 VP, L-L Device 02 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 VP, L-L Thermal resistance, junction-to-case (ΘJC) 2/ . . . . . . . . . . . . . . . . . . . 7.0°C/W Storage temperature range (TSTG) . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to +150°C Maximum power dissipation (PD) . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 W Junction temperature (TJ): Devices 01, 03 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C Device 02 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +135°C

Case operating temperature range (TC) . . . . . . . . . . . . . . . . . . . . . . . −55°C to +125°C Supply voltage range (VDD) . . . . . . . . . . . . . . . . . . .. . . . . . . . . . 4.5 V dc to 5.5 V dc Transceiver supply voltage range (VCC) . . . . . . . . . . . . . . . . . . . . . . . 4.75 V dc to 5.25 V dc Transceiver supply voltage (VEE): Devices 01, 03 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −12 or −15 (±5%) V dc Receiver differential voltage (VDR): Devices 01, 03 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 VP-P Device 02 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8.0 VP-P Logic dc input Voltage (VIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 to VDD V dc Receiver common mode input voltage range (VIC): Devices 01, 03 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±10 V dc Device 02 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±5.0 V dc Driver peak output current (IO): Devices 01, 03 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180 mA Device 02 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 700 mA Serial data rate range (SD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 to 1 MHz Clock duty cycle (DC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 ± 5% Operating frequency (FIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 ± .01% MHz

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012). . . . . . . . . . . . . . . . . . . . . 3/ percent

Document History

November 12, 2020
MICROCIRCUIT, DIGITAL, SERIAL MICROCODED MULTI-MODE INTELLIGENT TERMINAL, SILICON
Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q) and space application (device class V). A choice of case outlines and lead finishes...
October 7, 2015
MICROCIRCUIT, DIGITAL, SERIAL MICROCODED MULTI-MODE INTELLIGENT TERMINAL, SILICON
This drawing documents two product assurance class levels consisting of high reliability (device class Q) and space application (device class V). A choice of case outlines and lead finishes are...
June 4, 2014
MICROCIRCUIT, DIGITAL, SERIAL MICROCODED MULTI-MODE INTELLIGENT TERMINAL, SILICON
This drawing documents two product assurance class levels consisting of high reliability (device class Q) and space application (device class V). A choice of case outlines and lead finishes are...
March 4, 2013
MICROCIRCUIT, DIGITAL, SERIAL MICROCODED MULTI-MODE INTELLIGENT TERMINAL, SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q) and space application (device class V). A choice of case outlines and lead finishes are...
April 17, 2012
MICROCIRCUIT, DIGITAL, SERIAL MICROCODED MULTI-MODE INTELLIGENT TERMINAL, SILICON
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. Replaceability....
February 1, 2011
MICROCIRCUIT, DIGITAL, SERIAL MICROCODED MULTI-MODE INTELLIGENT TERMINAL, SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
July 30, 2007
MICROCIRCUIT, DIGITAL, SERIAL MICROCODED MULTI-MODE INTELLIGENT TERMINAL, SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
April 11, 2001
MICROCIRCUIT, DIGITAL, SERIAL MICROCODED MULTI-MODE INTELLIGENT TERMINAL, SILICON
A description is not available for this item.
December 21, 2000
MICROCIRCUIT, DIGITAL, SERIAL MICROCODED MULTI-MODE INTELLIGENT TERMINAL, SILICON
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. Microcircuits covered by...
April 12, 1999
MICROCIRCUIT, DIGITAL, SERIAL MICROCODED MULTI-MODE INTELLIGENT TERMINAL, SILICON
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. Microcircuits covered by...
January 17, 1996
MICROCIRCUIT, DIGITAL, SERIAL MICROCODED MULTI-MODE INTELLIGENT TERMINAL, SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
SMD-5962-94758
March 28, 1995
MICROCIRCUIT, DIGITAL, SERIAL MICROCODED MULTI-MODE INTELLIGENT TERMINAL, SILICON
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and...
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