scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number 1/ Circuit function Access Time 01 256K × 1 CMOS SRAM (CMOS-I/O) 60 02 256K × 1 CMOS SRAM (TTL-I/O) 60 03 256K × 1 CMOS SRAM (CMOS-I/O) 40 04 256K × 1 CMOS SRAM (TTL-I/O) 40 05 256K × 1 CMOS SRAM (TTL-I/O) 50

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as disignated in MIL-STD-1835 and as follows:

Outline letter Descriptive Designator Terminals Package Style X See figure 1 36 Flat pack Y See figure 1 40 Flat pack Z See figure 1 36 Flat pack

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC) ------------------------------------ −2.0 V dc to +7.0 V dc DC input voltage range (V_IN) ---------------------------------- −0.5 V dc to V_CC + 0.5 V dc DC output voltage range V_OUT) --------------------------------- −0.5 V dc to V_CC + 0.5 V dc Output voltage applied to high Z state ------------------------ −0.5 V dc to V_CC + 0.5 V dc Storage temperature range ------------------------------------- −65°C to +150°C Lead temperature (soldering, 5 sec) --------------------------- +250°C Thermal resistance, junction-to-case (Θ_JC): Cases X and Y --------------------------------------------- 3.31°C/Watt Maximum power dissipation (P_D) -------------------------------- 2.0 Watts Maximum junction temperature (T_J) ----------------------------- +175°C 4/

Supply voltage range (V_CC) ---------------------------------- 4.5 V dc to 5.5 V dc Supply voltage (V_SS) ---------------------------------------- 0.0 V dc High level (CMOS) input voltage range (V_IH) ----------------- 3.5 V dc to V_CC + 0.3 V dc High level (TTL) input voltage range (V_IH) ------------------ 2.2 V dc to V_CC + 0.5 V dc Low level (CMOS) input voltage range (V_IL) ------------------ −0.3 V dc to 1.5 V dc Low level (TTL) input voltage range (V_IL) ------------------- −0.5 V dc to 0.8 V dc Case operating temperature range (T_C) ----------------------- −55°C to +125°C

Fault coverage measurement of manufacturing Logic tests (MIL-STD-883, test method 5012) ----------------- 100 percent

intended Use: