scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-L-38535

For device classes M, B, and S, case outline(s) shall meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-I-38535, appendix C of MI-M-38510, and as listed below.

Outline letter Case outline X See figure 1 (32-lead, 1.685" × .600" × .225"), dual in-line package Y C-12 (32-terminal, .560" × .458" × .120"), rectangular chip carrier package Z See figure 1 (32-lead, .830" × .416" × .120"), flat package U See figure 1 (36-lead, .760" × .760" × .120"), pin grid array

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC) - - - - - - - - - - - - - −0.5 V dc to +6.0 V dc 3/ Operating case temperature range - - - - - - - - - - −55°C to +125°C Storage temperature range - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds) - - - - - - +300°C Thermal resistance, junction-to-case (Θ_JC): Case X - - - - - - - - - - - - - - - - - - - - - - 28°C/W 4/ Case Y - - - - - - - - - - - - - - - - - - - - - - See MIL-M-38510, appendix C Case Z - - - - - - - - - - - - - - - - - - - - - - 22°C/W 4/ Case U - - - - - - - - - - - - - - - - - - - - - - 20°C/W 4/ Maximum power dissipation (P_D) - - - - - - - - - - - 1.0 watt Junction temperature (T_J) - - - - - - - - - - - - - - +175°C 5/ Endurance - - - - - - - - - - - - - - - - - - - - - - 10,000 cycles/byte (minimum) Data retention - - - - - - - - - - - - - - - - - - - 10 years minimum

Supply voltage range (V_CC) - - - - - - - - - - - - - 4.5 V dc minimum to 5.5 V dc maximum Supply voltage (V_SS) - - - - - - - - - - - - - - - - 0.0 V dc High level input voltage range (V_IH) - - - - - - - - 2.0 V dc to V_CC + 1.0 V dc Low level input voltage range (V_IL) - - - - - - - - - −0.1 V dc to 0.8 V dc Case operating temperature range (T_C) - - - - - - - - −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012)- - - - - 6/ percent

intended Use: