DLA - SMD-5962-92061 REV D
MICROCIRCUIT, HYBRID, DIGITAL, MULTICHIP, DUAL CHANNEL, DRIVER-RECEIVER
| Organization: | DLA |
| Publication Date: | 6 December 1995 |
| Status: | inactive |
| Page Count: | 29 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). This drawing describes device requirements for hybrid microcircuits to be processed in accordance with MIL-PRF-38534. Two product assurance classes, military high reliability (device class H) and space application (device class K) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device classes H and K RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 MR63147M +5 V, dual channel, MIL-STD-1553 transceiver (Harris interface) 02 MR63147M-2 +5 V, dual channel, MIL-STD-1553 transceiver (Smith interface) 03 NHI-1559, NHI-1567, +5 V, dual channel, MIL-STD-1553 transceiver (standby low) NHI-1573, NHI-1579 04 NHI-1560, NHI-1568, +5 V, dual channel, MIL-STD-1553 transceiver (standby high) NHI-1574, NHI-1580 05 NHI-1563, NHI-1569, +5 V, dual channel, MacAir transceiver (standby low) NHI-1578, NHI-1593 06 NHI-1570, NHI-1577, +5 V, dual channel, MacAir transceiver (standby high) NHI-1581, NHI-1594 07 ACT4458-201-3 +5 V, dual channel, MIL-STD-1553 transceiver (standby low) 08 ACT4464-201-3 +5 V, dual channel, MIL-STD-1553 transceiver (standby high) 09 ACT4460-201-3 +5 V, dual channel, MacAir transceiver (standby low) 10 ACT4454-201-3 +5 V, dual channel, MacAir transceiver (standby high)
This device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation H or K Certification and qualification to MIL-PRF-38534
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style M See figure 1 20 Dual-in-line N See figure 1 20 Flat pack T See figure 1 36 Dual-in-line U See figure 1 36 Flat pack X See figure 1 36 Dual-in-line Y See figure 1 36 Flat pack Z See figure 1 24 Micro flat pack 4 See figure 1 36 Dual-in-line (ceramic) 5 See figure 1 36 Flat pack (ceramic)
The lead finish shall be as specified in MIL-PRF-38534 for classes H and K. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage range (VCC) . . . . . . . . . . . . . −0.3 V dc to +7.0 V dc Logic input voltage range . . . . . . . . . . . . . . . . . . −0.3 V dc to +5.5 V dc Receiver differential input voltage . . . . . . . . . . . . . 10 Vp-p Driver peak output current . . . . . . . . . . . . . . . . . +1.0 A Power dissipation (PD), device types 01 and 02: Hottest die (100% duty cycle) . . . . . . . . . . . . . . . 2.2 W Total hybrid (standby) . . . . . . . . . . . . . . . . . . 500 mW Total hybrid (100% duty cycle) . . . . . . . . . . . . . . 2.46 W Power dissipation (PD), device types 03 through 06: Hottest die (100% duty cycle) . . . . . . . . . . . . . . . 500 mW Total hybrid (standby) . . . . . . . . . . . . . . . . . . 450 mW Total hybrid (100% duty cycle) . . . . . . . . . . . . . . 950 mW Power dissipation (PD), device types 07 through 10: Total hybrid (standby) . . . . . . . . . . . . . . . . . . 100 mW Total hybrid (100% duty cycle) . . . . . . . . . . . . . . 2 W Storage temperature range . . . . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . . . . . . . +300°C Junction temperature (TJ) . . . . . . . . . . . . . . +135°C Thermal resistance, junction-to-case (θJC): Device types 01 through 06 . . . . . . . . . . . . . . . . 4°C/W (hottest die) Device types 07 through 10 . . . . . . . . . . . . . . . . 5°C/W Thermal resistance, case-to-air (θCA) . . . . . 20°C/W (still air)
Supply voltage range (VCC): Device types 01, 02, 07, 08, 09, and 10 . . . . . . . . . . +4.75 V dc to +5.25 V dc Supply voltage range (VCC), device types 03 through 06 . . . +4.5 V dc to +5.5 V dc Logic input voltage range . . . . . . . . . . . . . . . . . . 0 V dc to +5.0 V dc Receiver differential voltage . . . . . . . . . . . . . . . . 8.0 Vp-p Driver peak output current . . . . . . . . . . . . . . . . . +700 mA Maximum serial data rate . . . . . . . . . . . . . . . . . . 0 Hz to 1.0 MHz Case operating temperature range (TC) . . . . . . . . −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
Document History
