DLA - SMD-5962-89813
MICROCIRCUIT, HYBRID, LINEAR, FAST SETTLING, WIDEBAND OPERATIONAL AMPLIFIER
| Organization: | DLA |
| Publication Date: | 20 August 1990 |
| Status: | inactive |
| Page Count: | 8 |
scope:
This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with MIL-H-38534.
The complete part number shall be as shown in the following example:
The device type shall identify the circuit function as follows:
Device type Generic number Circuit function 01 1437 Wideband operational amplifier
The case outline shall be as designated in appendix C of MIL-M-38510, and as follows:
Outline letter Case outline G A-1 (8-lead, .370" × .185"), can package 3 C-4 (28-lead, .460" × .460" × .100"), square chip carrier package
Supply voltage (VCC) - - - - - - - - - - - - - - - - ±20 V dc Differential input voltage - - - - - - - - - - - - - ±VCC Common mode input voltage - - - - - - - - - - - - - ±VCC Maximum power dissipation (PD) 1/ - - - - - - - - - 500 mW Storage temperature range - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds) - - - - - - +300°C Thermal resistance, junction-to-case (ΘJC): Case G - - - - - - - - - - - - - - - - - - - - - - - 200°C/W Case 3 - - - - - - - - - - - - - - - - - - - - - - - 75°C/W Junction temperature (TJ) - - - - - - - - - - - - - +150°C
Supply voltage (VCC) - - - - - - - - - - - - - - - - ±15 V dc Ambient operating temperature range (TA) - - - - - - −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for original equipment design applications and logistic support of existing equipment.
Document History