IPC - J-STD-006
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
|Publication Date:||1 January 1995|
This standard prescribes the requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering applications; and for "specialy' electronic grade solders. This standard is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32.
This document is one of a set of three joint industry standards which prescribe the requirements and test methods for soldering materials for use in the electronics industry and, when adopted by a Government, for use on that Government's high reliability electronic hardware: J-STD-O04 covering soldering fluxes, J-STD-005 covering solder paste, and J-STD- 006 (this document) covering soldera lloys and solid solder forms.
Special electronic grade solders include all solders which do not fully comply with the requirements of standard solder alloys and solder materials listed herein. Some examples of special solders are anodes, ingots, preforms, bars with hook and eye ends, multiple-alloy solder powders, etc.