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IPC - J-STD-006

Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

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Organization: IPC
Publication Date: 1 May 2001
Status: inactive
Page Count: 29
scope:

SCOPE AND CLASSIFICATION

Scope This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering applications; and for "special" electronic grade solders. This is a quality control standard and is not intended to relate directly to the material's performance in the manufacturing process. Solders for applications

other than electronics should be procured using ASTM B32.

This standard is one of a set of three joint industry standards that

prescribe the requirements and test methods for soldering materials for

use in the electronics industry:

IPC/EIA J-STD-004 Requirements for Soldering Fluxes

IPC/EIA J-STD-005 Requirements for Soldering Pastes

IPC/EIA J-STD-006 Requirements for Electronic Grade Solder Alloys and

Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications.

Classification Soldering alloys covered by this standard shall be classified by alloy composition and impurity level, solder form and dimensional characteristics peculiar to the solder form, flux percentage and flux classification, if applicable. These classifications shall be

used as part of the standard description of solder products. (See 6.3.)

Alloy Composition The solder alloys covered by this standard include,

but are not limited to, the alloys listed in Appendix A, including pure tin and pure indium. Each alloy is identified by an alloy name, which is composed of a series of alphanumeric characters that identify the component elements in the alloy by chemical symbol and nominal percentage by mass.

Alloy Impurity Level The allowable impurity level of the solder alloys covered by this standard is identified with an alloy variation designator (A, B, C, D, E) as defined in 3.3. An alloy variation letter

is added to the end of an alloy name and becomes part of the name.

Solder Form The forms of solder materials covered by this set of

standards include paste (cream), bar, powder, ribbon, wire and special electronic grade solders which do not fully comply with the requirements of standard solder alloys and forms listed herein. Some examples of special form solders are anodes, ingots, preforms, bars with hook and

eye ends, and multiple-alloy solder powders.

A single-letter identifying symbol as defined below may be used.

P - Paste (Cream)

B - Bar D - Powder R - Ribbon W - Wire S - Special

Dimensional Characteristics Standard bar solders are further classified by unit mass. Wire solders are further classified by wire size (outside diameter) and unit mass. Ribbon solders are further classified by thickness, width and unit mass. Powder solders are further classified

by powder particle size distribution and unit mass. See 3.4.1 to 3.4.5.

Flux Percentage and Metal Content The nominal percentage of flux by

mass in solid-form solder products shall be specified. For solder paste products, metal content shall be specified instead. "Metal content" refers to the percentage of metal in solder paste by mass. (See 3.4.1 to 3.4.5.

Flux Classification The material of composition, activity level and halide content of fluxes covered by this set of standards shall be specified according to IPC/EIA J-STD-004.

intended Use:

Alloys covered by this standard are intended for use in various consumer, industrial, and commercial electronic soldering applications of industry and, when adopted by a governing entity, military... View More

Document History

October 1, 2017
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications Amendment 1
A description is not available for this item.
July 1, 2013
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, wire, and powder solders, for electronic soldering...
September 1, 2009
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering...
June 1, 2008
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications Amendment 1
This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering...
June 1, 2008
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering...
January 1, 2006
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering...
January 1, 2006
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering...
J-STD-006
May 1, 2001
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
Alloys covered by this standard are intended for use in various consumer, industrial, and commercial electronic soldering applications of industry and, when adopted by a governing entity, military...
January 1, 1995
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
This standard prescribes the requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic...

References

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