DOD - SMD 5962-93152
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 32K X 9 FIFO, MONOLITHIC SILICON
| Organization: | DOD |
| Publication Date: | 25 October 1994 |
| Status: | inactive |
| Page Count: | 24 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number 1/ Circuit function Access time 01 32K × 9 FIFO 40 ns 02 32K × 9 FIFO 25 ns 03 32K × 9 FIFO 20 ns
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style X GDIP1-T28 or CDIP2-T28 28 Dual-in-line Y CQCC1-N32 32 Rectangular leadless chip carrier
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage range to ground potential (VCC) . . . . . −0.5 V dc to +7.0 V dc DC voltage range applied to outputs in high-Z state . . . −0.5 V dc to +7.0 V dc DC input voltage range (VIN) . . . . . . . . . . . . . . −3.0 V dc to +7.0 V dc DC output current . . . . . . . . . . . . . . . . . . . . 20 mA Maximum power dissipation . . . . . . . . . . . . . . . . 1.0 W Lead temperature (soldering, 10 seconds) . . . . . . . . +260°C Thermal resistance, junction-to-case (θJC) . . . . . . . See MIL-STD-1835 Junction temperature (TJ) . . . . . . . . . . . . . . . . +175°C Storage temperature range (TSTG) . . . . . . . . . . . . −65°C to +150°C Temperature under bias range . . . . . . . . . . . . . . −55°C to +125°C
Supply voltage range (VCC) . . . . . . . . . . . . . . . +4.5 V dc minimum to +5.5 V dc maximum Ground voltage (GND) . . . . . . . . . . . . . . . . . . 0 V dc Input high voltage (VIH) . . . . . . . . . . . . . . . . 2.2 V dc minimum Input low voltage (VIL) . . . . . . . . . . . . . . . . . 0.8 V dc maximum Case operating temperature range (TC) . . . . . . . . . . −55°C to +125°C
Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . XX percent 3/
intended Use:
Microcircuits conforming to this drawing are intended for use for government microcircuit applications (original equipment), design applications, and logistics purposes.
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