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IEC 62090

Product package labels for electronic components using bar code and two-dimensional symbologies

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Organization: IEC
Publication Date: 1 November 2002
Status: inactive
Page Count: 98
ICS Code (Electronic component assemblies): 31.190
ICS Code (Integrated circuits. Microelectronics): 31.200
ICS Code (Information coding): 35.040

Document History

IEC 62090
April 1, 2017
Product package labels for electronic components using bar code and twodimensional symbologies
This document applies to labels on the packaging of electronic components for automatic handling in B2B processes. These labels use linear bar code and two-dimensional (2D) symbols. Labels for direct...
IEC 62090
November 1, 2002
Product package labels for electronic components using bar code and two-dimensional symbologies
A description is not available for this item.

References

This document is referenced by:
EN IEC 61760-3 - Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
Published by CENELEC on March 1, 2021
This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for...
This document is referenced by:
IEC 61760-3 - Surface mounting technology – Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
Published by IEC on February 1, 2021
This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for...
This document is referenced by:
BS EN 61188-5-8 - Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
Published by BSI on May 30, 2008
A description is not available for this item.
This document is referenced by:
BS EN IEC 61760-1 - Surface Mounting Technology Part 1: Standard method for the specification of surface mounting components (SMDs)
Published by BSI on September 30, 2020
A description is not available for this item.
This document is referenced by:
BS EN IEC 61760-3 - Surface mounting technology Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
Published by BSI on March 31, 2021
A description is not available for this item.
This document is referenced by:
BS ISO 22742 - Packaging - Linear bar code and two-dimensional symbols for product packaging
Published by BSI on July 31, 2011
A description is not available for this item.
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