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DLA - SMD-5962-87626

MICROCIRCUIT, DIGITAL, ADVANCED CMOS, HEX D FLIP-FLOP WITH MASTER RESET, MONOLITHIC SILICON

inactive
Organization: DLA
Publication Date: 26 June 1987
Status: inactive
Page Count: 13
scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device type shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54AC174 Hex D flip-flop with master reset

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline E D-2 (16-lead, ¼" × ⅞"), dual-in-line package F F-5 (16-lead ¼" × ⅜"), flat-package 2 C-2 (20-terminal .350" × .350"), square chip carrier package

Supply voltage range 1/ - - - - - - - - - - - - - - −0.5 V dc to +6.0 V dc DC input voltage 1/ - - - - - - - - - - - - - - - - −0.5 V dc to VCC +0.5 V dc DC output voltage 1/ - - - - - - - - - - - - - - - −0.5 V dc to VCC +0.5 V dc Clamp diode current - - - - - - - - - - - - - - - - ±20 mA DC output current (per pin) - - - - - - - - - - - - ±50 mA DC VCC or GND current (per pin) - - - - - - - - - - ±100 mA Storage temperature range - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (PD)- - - - - - - - - - - 500 mW Lead temperature (soldering, 10 seconds)- - - - - - +245° C Thermal resistance, junction-to-case (θJC): Cases E and F - - - - - - - - - - - - - - - - - - See MIL-M-38510, appendix C Case 2 - - - - - - - - - - - - - - - - - - - - - 60°C/W 2/ Junction temperature (Tj) 3/ - - - - - - - - - - - +175°C

Supply voltage (VCC) 4/ - - - - - - - - - - - - - - - - 3.0 V dc to 5.5 V dc Input voltage - - - - - - - - - - - - - - - - - - - - - 0.0 V dc to VCC Output voltage - - - - - - - - - - - - - - - - - - - - 0.0 V dc to VCC Case operating temperature range (TC) - - - - - - - - - −55°C to +125°C Input rise or fall times: VCC = 3.6 V - - - - - - - - - - - - - - - - - - - - - 0 to 116 ns (10-90 percent, 40 ns/V) VCC = 5.5 V - - - - - - - - - - - - - - - - - - - - - 0 to 88 ns (10-90 percent, 20 ns/V) Minimum setup time, Dn to CP (TS): TC = +25°C: VCC = 3.0 V - - - - - - - - - - - - - - - - - - - - 6.5 ns VCC = 4.5 V - - - - - - - - - - - - - - - - - - - - 5.0 ns TC = −55°C to +125°C: VCC = 3.0 V - - - - - - - - - - - - - - - - - - - - 7.5 ns VCC = 4.5 V - - - - - - - - - - - - - - - - - - - - 5.5 ns Minimum hold time, Dn to CP (tH): TC = +25°C: VCC = 3.0 V - - - - - - - - - - - - - - - - - - - - 3.0 ns VCC = 4.5 V - - - - - - - - - - - - - - - - - - - - 3.0 ns TC = −55°C to +125°C: VCC = 3.0 V - - - - - - - - - - - - - - - - - - - - 3.0 ns VCC = 4.5 V - - - - - - - - - - - - - - - - - - - - 3.0 ns Minimum pulse width CP (tW): TC = +25°C: VCC = 3.0 V - - - - - - - - - - - - - - - - - - - - 5.5 ns VCC = 4.5 V - - - - - - - - - - - - - - - - - - - - 5.0 ns TC = −55°C to +125°C: VCC = 3.0 V - - - - - - - - - - - - - - - - - - - - 7.0 ns VCC = 4.5 V - - - - - - - - - - - - - - - - - - - - 5.0 ns Minimum pulse width [M bar][R bar] (tW): TC = +25°C: VCC = 3.0 V - - - - - - - - - - - - - - - - - - - - 5.5 ns VCC = 4.5 V - - - - - - - - - - - - - - - - - - - - 5.0 ns TC = −55° to +125°C: VCC = 3.0 V - - - - - - - - - - - - - - - - - - - - 7.0 ns VCC = 4.5 V - - - - - - - - - - - - - - - - - - - - 5.0 ns Minimum recovery time, [M bar][R bar] to CP (tREC): TC = +25°C: VCC = 3.0 V - - - - - - - - - - - - - - - - - - - - 2.5 ns VCC = 4.5 V - - - - - - - - - - - - - - - - - - - - 2.0 ns TC = −55°C to +125°C: VCC = 3.0 V - - - - - - - - - - - - - - - - - - - - 3.0 ns VCC = 4.5 V - - - - - - - - - - - - - - - - - - - - 2.0 ns Maximum frequency (fMAX): TC = +25°C: VCC = 3.0 V - - - - - - - - - - - - - - - - - - - - 90 MHz VCC = 4.5 V - - - - - - - - - - - - - - - - - - - - 95 MHz TC = −55°C to +125°C: VCC = 3.0 V - - - - - - - - - - - - - - - - - - - - 65 MHz VCC = 4.5 V - - - - - - - - - - - - - - - - - - - - 90 MHz

intended Use:

Microcircuits conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for... View More

Document History

February 22, 2019
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, RADIATION HARDENED, HEX D FLIP-FLOP WITH MASTER RESET, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
March 23, 2016
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, RADIATION HARDENED, HEX D FLIP-FLOP WITH MASTER RESET, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
October 28, 2015
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, RADIATION HARDENED, HEX D FLIP-FLOP WITH MASTER RESET, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
February 22, 2012
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, HEX D FLIP-FLOP WITH MASTER RESET, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
June 24, 2005
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, HEX D FLIP-FLOP WITH MASTER RESET, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
July 18, 2002
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, HEX D FLIP-FLOP WITH MASTER RESET, MONOLITHIC SILICON
A description is not available for this item.
SMD-5962-87626
June 26, 1987
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, HEX D FLIP-FLOP WITH MASTER RESET, MONOLITHIC SILICON
This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices"....

References

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