scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q, and M) and space application (device class and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked device shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number 1/ Circuit function Data retention Access time 01 256K × 4 SRAM Yes 45 ns 02 256K × 4 SRAM No 45 ns 03 256K × 4 SRAM Yes 35 ns 04 256K × 4 SRAM No 35 ns 05 256K × 4 SRAM Yes 25 ns 06 256K × 4 SRAM No 25 ns 07 256K × 4 SRAM Yes 20 ns 08 256K × 4 SRAM No 20 ns 09 256K × 4 SRAM Yes 15 ns 10 256K × 4 SRAM No 15 ns

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and Qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X See figure 1 28 dual-in-line Y See figure 1 28 SOJ package Z CDCC1-N28 28 dual leadless chip carrier U CDFP1-F32 32 flat pack T See figure 1 32 rectangular leadless chip carrier M See figure 1 32 SOJ pckage

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC) - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc DC input voltage range (V_IN) - - - - - - - - - - - - −0.5 V dc to V_CC+0.5 V dc 3/ DC output voltage range (V_OUT) - - - - - - - - - - - −0.5 V dc to V_CC+0.5 V dc 3/ Storage temperature range - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (P_D) - - - - - - - - - - - 1.0 W Lead temperature (soldering, 10 seconds) - - - - - - +260°C Thermal resistance, junction-to-case (Θ_JC): Case X - - - - - - - - - - - - - - - - - - - - - - 15°C/W 4/ Cases Y and T - - - - - - - - - - - - - - - - - - - 18°C/W 4/ Cases Z and U - - - - - - - - - - - - - - - - - - - See MIL-STD-1835 Output voltage applied in high Z state - - - - - - - −0.5 V dc to V_CC+0.5 V dc Maximum power dissipation, (P_D) - - - - - - - - - - 1.0 W Maximum junction temperature (T_J) - - - - - - - - - +150°C 5/

Supply voltage range (V_CC) - - - - - - - - - - - - 4.5 V dc minimum to 5.5 V dc maximum Supply voltage range (V_SS) - - - - - - - - - - - - 0.0 V dc High level input voltage range (V_IH) - - - - - - - 2.2 V dc to V_CC + 0.5 V dc Low level input voltage range (V_IL) - - - - - - - −0.5 V dc to 0.8 V dc Case operating temperature range (_TC - - - - - - - −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - 6/ percent

intended Use: