DLA - SMD-5962-95690 REV B
MICROCIRCUIT, LINEAR, RADIATION HARDENED, QUAD LOW NOISE, OPERATIONAL AMPLIFIER, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 25 June 1997 |
| Status: | inactive |
| Page Count: | 16 |
scope:
1. DATE NOTICE OF REVISION (NOR) (YYMMDD) Form Approved 97-06-25 OMB No. 0704-0188 THIS REVISION DESCRIBED BELOW HAS BEEN AUTHORIZED FOR THE DOCUMENT LISTED.
Public reporting burden for this collection is estimated to average 2 hours per response, including the time for reviewing instructions, searching existing data sources, gathering and maintaining the data needed, and completing and reviewing the collection of information. Send comments regarding this burden estimate or any other aspect of this collection of information, including suggestions for reducing this burden, to Department of Defense, Washington Headquarters Services, Directorate for Information Operations and Reports, 1215 Jefferson Davis Highway, Suite 1204, Arlington, VA 22202-4302, and to the Office of Management and Budget, Paperwork Reduction Project (0704-0188), Washington, DC 20503.
PLEASE DO NOT RETURN YOUR COMPLETED FORM TO EITHER OF THESE ADDRESSED. RETURN COMPLETED FORM TO THE GOVERNMENT ISSUING CONTRACTING OFFICER FOR THE CONTRACT/PROCURING ACTIVITY NUMBER LISTED IN ITEM 2 OF THIS FORM.
2. PROCURING ACTIVITY NO. 3. DODAAC b. ADDRESS (Street, City, State, Zip Code) 5. CAGE CODE 6. NOR NO. 4. ORIGINATOR Defense Supply Center, Columbus 67268 5962-R371-97 3990 East Broad Street a. TYPED NAME (First, Middle Initial, Columbus, OH 43216-5000 7. CAGE CODE 8. DOCUMENT NO. Last) 67268 5962-95690 9. TITLE OF DOCUMENT 11. ECP NO. MICROCIRCUIT, LINEAR, RADIATION HARDENED, QUAD, LOW NOISE, 10. REVISION LETTER OPERATIONAL AMPLIFIER, MONOLITHIC SILICON N/A a. CURRENT b. NEW A B 12. CONFIGURATION ITEM (OR SYSTEM) TO WHICH ECP APPLIES All 13. DESCRIPTION OF REVISION
Sheet 1: Revisions Itr column; add "B".
Revisions description column; add "Changes in accordance with NOR 5962-R371-97".
Revisions date column; add "97-06-25".
Revision level block; add "A" to "B".
Rev status of sheets; for sheets 1 change from "A" to "B". For sheet 2, 3, and 8 add "B".
Sheet 2: 1.2.4 Case outlines.; for the outline letter column add "X". For descriptive designator column add "CDFP3-F14". For terminals column add "14". For package style column add "Flat pack".
Revision level block; add "B".
Sheet 3: 1.3 Absolute maximum ratings.; delete "Maximum package power dissipation (TA = +125°C) ... 0.67 W".
For thermal resistance, junction-to-cause (θJC), change from "24°C/W" to "case C ... 24°C/W, case X ... 30°C/W".
For thermal resistance, junction-to-ambient (θJA), change from "75°C/W" to "case C ... 75°C/W, case X ... 116°C/W"
Revision level block; add "B".
Sheet 8: FIGURE 1. Terminal connections.; for case outline, change from "C" to "C, X".
Revision level block; add "B".
14. THIS SECTION FOR GOVERNMENT USE ONLY a. (X one) X (1) Existing document supplemented by the NOR may be used in manufacture. (2) Revised document must be received before manufacturer may incorporate this change. (3) Custodian of master document shall make above revision and furnish revised document. b. ACTIVITY AUTHORIZED TO APPROVE CHANGE FOR GOVERNMENT c. TYPED NAME (First, Middle Initial, Last) DSCC-VAS Raymond Monnin d. TITLE e. SIGNATURE f. DATE SIGNED (YYMMDD) Chief, Microelectronics Team Raymond Monnin 97-06-25 15a. ACTIVITY ACCOMPLISHING REVISION b. REVISION COMPLETED (Signature) c. DATE SIGNED (YYMMDD) DSCC-VAS Dan Wonnell 97-06-25
DD Form 1695, APR 92
Previous editions are obsolete.
Document History
