IPC-7526
Stencil and Misprinted Board Cleaning Handbook
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| Organization: | IPC |
| Publication Date: | 1 February 2007 |
| Status: | active |
| Page Count: | 32 |
scope:
This Handbook addresses the removal of solder paste and uncured/unreacted SMT adhesives from stencils, misprinted printed circuit boards (PCBs) and application tools connected to the soldering paste application processes.
Purpose The purpose of this handbook is to provide a basic understanding of stencil/misprint cleaning processes. The handbook serves as a guide to users or prospective users of stencil/misprint cleaning technology.
Document History
March 1, 2022
Stencil and Misprinted Board Cleaning Handbook
Statement of Scope
This handbook addresses understencil cleanliness during stencil printing, removal of solder paste from stencils following the cleaning process and misprint PCB board cleaning...
IPC-7526
February 1, 2007
Stencil and Misprinted Board Cleaning Handbook
This Handbook addresses the removal of solder paste and uncured/unreacted SMT adhesives from stencils, misprinted printed circuit boards (PCBs) and application tools connected to the soldering paste...