scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type(s) Generic number Circuit function 01 54HC4514 4-to-16 line decoder/demultiplexer with input latches

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style J GDIP1-T24 24 Dual-in-line package

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_CC) −0.5 V dc to +7.0 V dc DC input voltage range (V_IN −0.5 V dc to VCC +0.5 V dc DC input diode current (I_IK) (V_IN < −0.5 V or V_IN > V_CC + 0.5 V) ±20 mA DC output diode current (I_OK) (V_O < −0.5 V or V_O > V_CC + 0.5 V) ±20 mA DC drain current, per output (I_OUT) (−0.5 V < V_O < V_CC + 0.5 V) ±25 mA DC output source or sink current per output pin (I_OUT), (V_O > −0.5 V or V_O < V_CC + 0.5 V) ±25 mA DC V_CC or ground current (I_CC) ±50 mA Storage temperature range (T_STG) −65°C to +150°C Lead temperature (soldering, 10 seconds) +265°C Thermal resistance, junction-to-case (Θ_JC) 20°C/W Thermal resistance, junction-to-ambient (Θ_JA) 60°C/W Junction temperature (T_J) +175°C Maximum package power dissipation at T_A = +125°C (P_D) 0.83 W 4/

Supply voltage range (V_CC) +2.0 V dc to +6.0 V dc Input voltage range, high (V_IH): V_CC = 2.0 V 1.5 V V_CC = 4.5 V 3.15 V V_CC = 6.0 V 4.2 V Input voltage range, low (V_IL): V_CC = 2.0 V 0.5 V V_CC = 4.5 V 1.35 V V_CC = 6.0 V 11.8 V Input voltage range (V_IN) +0.0 V dc to V_CC Output voltage range (V_OUT) +0.0 V dc to V_CC Case operating temperature range (T_C) −55°C to +125°C Maximum input rise and fall time (t_r, t_f): V_CC = 2.0 V 1000 ns V_CC = 4.5 V 500 ns V_CC = 6.0 V 400 ns

intended Use: