scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Switch action 01 DG411 CMOS, quad, SPST analog switch (See figures 2, 3) 02 DG412 CMOS, quad, SPST analog switch (See figures 2, 3) 03 DG413 CMOS, quad, SPST analog switch (See figures 2, 3)

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 dual-in-line F GDFP2-F16 or CDFP3-F16 16 flat package 2 CQCC1-N20 20 square leadless chip carrier X CDFP4-F16 16 flat package

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 of classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

V+ to V− . . . . . . . . . . . . . . . . . . . . . . . . 44 V dc Ground to V− . . . . . . . . . . . . . . . . . . . . . . 25 V dc Logic supply voltage (V_L) to V− . . . . . . . . . . . . (Ground −0.3 V dc) to 44 V dc 2/ Digital inputs, V_S, V_D . . . . . . . . . . . . . . . . . (V−) −2.0 V dc to (V+) +2.0 V dc or 30 mA, whichever occurs first 2/ Continuous current (any terminal) . . . . . . . . . . . 30 mA Source or drain current (pulsed, 1.0 ms, 10% duty cycle) . . . . . . . . . . . 100 mA Storage temperature range . . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . . . . . +300°C Power dissipation, T_A = +25°C (P_D): Case E . . . . . . . . . . . . . . . . . . . . . . . . 900 mW 3/ Case F and X . . . . . . . . . . . . . . . . . . . . . 485 mW 4/ Case 2 . . . . . . . . . . . . . . . . . . . . . . . . 750 mW 5/ Thermal resistance, junction-to-case (Θ_JC) . . . . . . . See MIL-STD-1835

Unipolar supply voltage: V+ . . . . . . . . . . . . . . . . . . . . . . . . . 12 V dc V− . . . . . . . . . . . . . . . . . . . . . . . . . 0 V dc Bipolar supply voltage: V+ . . . . . . . . . . . . . . . . . . . . . . . . . 15 V dc V− . . . . . . . . . . . . . . . . . . . . . . . . . −15 V dc Logic supply voltage (V_L) . . . . . . . . . . . . . . . 5.25 V dc Ambient operating temperature range (T_A) . . . . . . . . −55°C to +125°C

intended Use: